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瀏覽:474
日期:2024-09-10
Chip On Board Packaging of Light Emitting Diodes and Thermal
Characterizations. Sebastien LABAU, Nicolas PICARD, Adrien GASSE*,
Stéphane BERNABE, ......
瀏覽:770
日期:2024-09-06
The optical properties of high power Warm-White Light Emitting Diodes (WW-
LEDs) in Chip-on-Board (COB) package of Dam-and-Fill encapsulation with
three ......
瀏覽:464
日期:2024-09-09
Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and
... Glass; Light emitting diodes; Packaging; Phosphors; Silicon; Substrates ......
瀏覽:1252
日期:2024-09-08
In this paper an improved LED (Light emitting diode) packaging structure was
proposed, which is based on COB (Chip On Board) technology. This research ......
瀏覽:1456
日期:2024-09-09
23 Sep 2014 ... Optical Performance Enhancement for Chip-on-Board Packaging LEDs ... Light-
emitting diodes (LEDs); TiO₂ nanoparticle/silicone composite ......
瀏覽:1272
日期:2024-09-05
ABSTRACT High Brightness Light-Emitting Diodes (HB-LEDs) are key devices
for the solid state lighting applications. Nowadays, thermal management in LEDs
......
瀏覽:676
日期:2024-09-03
2013年7月10日 ... LED (light-emitting diode) COB (Chip on Board) packaging technology and
applications thereof. CN 102738324 B. Abstract translated from ......