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日期:2024-07-19
shrinking involves extensive use of circuit under pad (CUP) or bond over active ... CUP however, introduces more potential failure modes just as increased....
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日期:2024-07-15
The reliability of circuits (wiring and vias) under bond pads has been studied for both Au wire bonding and Cu wire bonding, for bond pads and wiring levels ......
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日期:2024-07-15
Comprehensive Process Design for Low-cost Chip Packaging with Circuit-under-pad (CUP) Strucure in Porous-SiOCH Film. M. Tagami, H. Ohtake, M. Abe, F. Ito ......
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日期:2024-07-19
1. Recent Development Work in IC. Bond Pad Structure and Circuit. Under Pad. Stevan Hunter. Presented to IMAPS Student Chapter, UI, 29 SEP 2011 ......
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日期:2024-07-20
本研究針對在先進的半導體晶圓製程上,鋁墊下的空間被充分的利用而發展之CUP (Circuit Under Pad) 結構,探討鋁墊下電路型晶片於銲線製程中因鋁墊龜裂所衍生 ......
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日期:2024-07-17
製程選擇建議:. 1. TN90GUTM將涵蓋RF、Analog、Mixed-Signal與Logic Circuit之電路應用需求,提供 .... 內含新版本ESD I/O PAD,並採用CUP(Circuit Under Pad)....
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日期:2024-07-17
2007年7月28日 - 最近許多研究企圖想改善並使用鋁墊下方之空間,因而修改線路之設計之規則,鋁墊下出現有線路通過之結構(CUP)被發展出來。且需求大量的驗證 ......