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日期:2024-08-17
Deformation and cracking are found together on traditional pad structures that have experienced too much stress. But deformation in the Al of CUP pads is....
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日期:2024-08-18
(This is part 2, continued from “Use of harsh Wafer Probing to Evaluate Traditional Bond Pad Structures”). Goals for circuit under pad (CUP) in aluminum ......
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日期:2024-08-16
Robust CUP Pad Structure Design with Thin Pad Metal for Cu Wire Bonding. Keywords: Cu wire bonding, CUP pad (circuit under pad) , ULSI semiconductor ......
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日期:2024-08-18
structures [4]. This work examined only the mechanical response of the pad structures. The effect of wirebonding over ESD structures was assessed for 3- metal ......
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日期:2024-08-19
2012年9月6日 - Wafer nodes, lowK, surface metal pad, metal pad thickness, metal layer number and thickness , Circuit Under Pad (CUP), via type, via structure,....
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日期:2024-08-15
2007年10月11日 - We will focus on our Staggered CUP IO implementation using. Encounter ... is that the overall height of the pad structure increases significantly ....
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日期:2024-08-14
2010年1月21日 - A brassiere cup and pad structure is revealed. The brassiere cup and pad structure consists of two outer linings made from polypropylene and ......