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![IMAPS - Abstract Preview - IMAPS - International Microelectronics Assembly and Packaging]()
www.imaps.orgAbstract Preview Here is the abstract you requested from the Wirebond_2010 technical program page. ... Ke ...瀏覽：652 -
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circuitsassembly.comNEWARK, NY -- IEC Electronics says a pair of proxy advisors are recommending stockholders support the cur ...瀏覽：392
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日期：2024-07-17
Different combinations of EFO current and firing time settings were used to obtain the same FAB diameter ......
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日期：2024-07-10
Wire Diameter. (依實際使用金線尺寸設定). FAB Size (Spec1.85-2.2mils) (燒球大小). EFO Current. (放電電流大小). EFO Gap. (放電間隙). Tail Extension. (預留線尾 ......
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日期：2024-07-10
and model depend only on the EFO current. The FAB formation speed can be as high as 90.4 μm/ms at an EFO current of. 60 mA. A minimum EFO time is ......
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日期：2024-07-10
Effect of EFO settings on microstructure and hardness in the FAB of copper bonding ... Low EFO current results in larger grain size in both FAB and ball neck....
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日期：2024-07-10
Cu FABs produced using EFO current (I EFO) and EFO time (t. EFO) of 250mA and 0.118ms, respectively, have 14.29HV (21%) higher hardness than those ......
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日期：2024-07-12
EFO time, EFO gap and recrystallization were also studied. The results show ... With the increase of EFO current and time, the length of HAZ becomes longer....
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日期：2024-07-12
2.5.2 Electric Flame-Off Current and Firing Time EFO current is supplied to form an FAB [79] during the first step in the wire bonding cycle. The heat-affected ......
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日期：2024-07-12
2012年8月22日 - ASM ASM EFO Sparking & Non-stick Detection ASM Principle of Sparking ? The Spark generator is a high voltage programmable current ......
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