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日期:2024-07-16
ilver Alloy Wire Bonding Te c hnolog y Solutions Questions? Contact us: marketing@amkor.com Visit Amkor Technology online for locations and to view the most current product information. A huge increase in the price of gold (Au) has driven the need for low...
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日期:2024-07-12
8 T T Capillary Wire Bonding The Tip Diameter (“T” Dimension) The capillary tip diameter should generally be as large as the bonding application will allow (within reason – there is a law of diminishing returns). A large tip diameter provides the maximum ...
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日期:2024-07-15
watch video Bonding process: The machine bonds a bump on the target pad. Afterwards the bond head moves up and the wire is torn off. Then a new ball is automatically formed with the help of EFO (Electronic Flame Off). Now the bonder is ready to set the ne...
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日期:2024-07-10
The stable bonding of gold wire is becoming more and more important with the development of high integration and miniaturization of semiconductor....
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日期:2024-07-11
Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding. A. Pequegnat Æ C. J. Hang Æ M. Mayer Æ. Y. Zhou Æ J. T. ......
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日期:2024-07-15
In this chapter, the details of the wire bonding process are discussed. .... PdCu wire have shown that at a higher EFO current, an FAB with bare Cu wire has....
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日期:2024-07-13
Wire-Bonding - Thermosonic Bonding. Electronic Flame Offs (EFO's) ... Process for all types of EFO used on various Wire Bonder machines such as ASM, K&S, ......