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日期:2024-08-04
The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets: Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die) MEMS Automotive Sensors RFID LED Optoelectronic For questions regarding the Nova Plus Die ......
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日期:2024-08-06
Head on this page. go to sub menu go to text go to text site Information Products & Solutions Support Search Panasonic Global Site Industrial Devices Business > Panasonic Factory Solutions > Device Related Systems > Flip Chip Bonder Global Home Japanese...
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日期:2024-08-06
AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (+/- 0.5 µm). See website: http://www.amicra... ... SAMSUNG Flip Chip Mounter(Bonder) SFM2 Series - Duration: 2:49. by SAMSUNG SMT 1,991 ......
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日期:2024-08-04
Thermosonic bonding of die to substrate with FINEPLACER Die Bonder. Shows pickup, alignment, placement and bonding. More information at http://eu.finetech.de... ... ic chip gold recycle gold wire bonding - Duration: 7:32. by The Best Gold Extraction 68,69...
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日期:2024-08-05
Flip Chip rework is a rather new field becoming more and more important in order to save costs by recycling valuable materials. Typical flip chip applications can be found in TFT display technology which is used for LCD, plasma, e-ink, OLED or 3D technolo...
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日期:2024-08-08
Automated, sub-micron die bonder for flip chip bonding and optoelectronic applications, versatile platform for various assembly technologies including thermosonic bonding, ultrasonic bonding, adhesives, soldering, UV curing. ... The FINEPLACER ® femto is ...