search:flip chip bonder相關網頁資料
-
-
![台灣芝浦先進科技股份有限公司]()
www.shibaura.com.tw•液晶面板生產設備 FPD Manufacturing Equipment (日語) (英語) Array Process : Wet Cleaning ／ Stripping ／ Developing ／ Etching Equipment Cell Process : Inkjet Coater ／ Cell Assembly Equipment Module Process : Outer Lead Bonding System瀏覽：505 -
![Flip Chip Bonder - ASM Pacific Technology Ltd]()
www.asmpacific.comFlip Chip Bonder. High speed, precise and flexible solution to Flip Chip applications. Flux Dispensing /. Dual Head Flux ...瀏覽：518
flip chip bonder的相關文章
flip chip bonder的相關商品
瀏覽：578
日期：2024-08-07
Flip-Chip Bonder. ... 全自動量產型Flip Chip bonder，應用於高階覆晶封裝技術.
more. 產品應用. 產品規格. 聯絡方式 ......
瀏覽：780
日期：2024-08-04
The AFC Plus is a die bonder and flip chip bonder system with high precision and
placement accuracy (+/ 0.5 µm), ......
瀏覽：1157
日期：2024-08-05
AMICRA Microtechnologies' high precision die bonder and flip chip bonders,
wafer ink systems and dispense & test ......
瀏覽：1133
日期：2024-08-07
... Flip Chip / Die Bonder. FC150 Flip Chip Bonder - Reflow Arm. FC150 Flip Chip
Bonder - Gas Confining Enclosure ......
瀏覽：1170
日期：2024-08-06
Flip Chip Bonder (for SiP/COC/CSP) FC3000S. Features. A semi-automatic
machine, suited for conducting R&D work ......
瀏覽：937
日期：2024-08-04
Flip chip bonder which can be switched to either the thermo-compression
process or ultrasonic bonding process with a ......
瀏覽：762
日期：2024-08-11
Automated, sub-micron die bonder for flip chip bonding and optoelectronic
applications, versatile platform for various ......
網友正在看
熱門 microsoft 文章
熱門 zenfone 文章
