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日期:2024-07-04
Samsung MCP overview. Samsung Multi-Chip Package memory key features, benefits, application areas. Find out more Samsung MCP memory information here. ... Samsung Multi-Chip Packages Innovative "chip-stack" design optimizes board space Find out why ......
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日期:2024-07-10
Ever-increasing expectations for mobile device performance are driving the need for versatile mobile memory solutions. Users and suppliers are collaborating to develop ... LPDDR4 Published in August 2014, JESD209-4 LPDDR4 is designed to significantly boos...
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日期:2024-07-06
Samsung MCP overview. Samsung Multi-Chip Package memory key features,
benefits, application areas. Find out more ......
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日期:2024-07-08
Designers are increasingly turning to multichip package (MCP) solutions to
achieve the smallest possible footprint while ......
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日期:2024-07-08
By offering multiple memory technologies including NAND Flash, low power
SDRAM and e-MMC in a single package, ......
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日期:2024-07-08
MCP Memory MCP ( Multi-Chip Package) Memory 1Gbits (128 x 8) NAND Flash Memory / 512Mbits (32 x 16) SDRA ......
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日期:2024-07-09
MCP Memory MCP ( Multi-Chip Package) Memory 1Gbits (128 x 8) NAND Flash Memory / 512Mbits (32 x 16) SDRA ......
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日期:2024-07-07
電子工程專輯提供相關 Memory MCP技術文章及相關 Memory MCP新聞趨勢,及更新最新相關 Memory MCP電子產品技術. . ......