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![Bond pad F-crystal defect control and monitoring]()
ieeexplore.ieee.orgBonding pad crystal defect was observed on wafers before die saw. To eliminate and monitor the defect, a study was ...瀏覽：686 -
![Bond pad F-crystal defect control and monitoring - IEEE Xplore]()
ieeexplore.ieee.orgBonding pad crystal defect was observed on wafers before die saw. To eliminate and monitor the defect, a study was ...瀏覽：1447
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瀏覽：309
日期：2024-07-21
Abstract - Bonding pad crystal defect was observed on wafers before die saw. To
eliminate and monitor the defect,....
瀏覽：428
日期：2024-07-14
AlCu bond pad crystal defect is observed after wafer processing and before die
sawing. It affects wire bonding or bump....
瀏覽：1313
日期：2024-07-20
Abstract. AlCu bond pad crystal defect is observed after wafer processing and
before die sawing. It affects wire bonding ......
瀏覽：1016
日期：2024-07-20
Abstract. AlCu bond pad crystal defect is observed after wafer processing and
before die sawing. It affects wire bonding ......
瀏覽：609
日期：2024-07-15
12 Feb 2009 ... This paper firstly introduces semiconductor process flow, then introduces the
definition and impact of ......
瀏覽：1442
日期：2024-07-19
ABSTRACT Bonding pad crystal defect was observed on wafers before die saw.
To eliminate and monitor the defect, ......
瀏覽：1026
日期：2024-07-20
Finally, proper humidity range for the elimination of pad crystal defects was
delineated. 【作者单位】：Quality Engineering ......
瀏覽：838
日期：2024-07-15
This paper firstly introduces semiconductor process flow, then introduces the
definition and impact of the pad crystal ......
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