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瀏覽:735
日期:2024-08-11
Laser Grooving with Blade Saw Scribe Line Width (um), 60, 50, 50, 50, 50.
Stealth Dicing Scribe Line Width (um), 30, 30, 10, 10, 10. Wafer Blade Saw
Scribe line ......
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日期:2024-08-09
之前对切割道的理解是中间是scribe line,然后两边是seal ring,最近看FAB的文档,
从切割道到die的isolation顺序依此是scribe line-->scribe line ......
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日期:2024-08-09
To break the wafer, a scribe line must be created in the wafer surface along the
streets where the break is desired. This line creates a stress concentration factor,
......
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日期:2024-08-12
18 Nov 2010 ... The scribe line structure includes a semiconductor substrate having a die region,
a die seal ring region, disposed outside the die region, ......
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日期:2024-08-15
Scribe Lines. Main Index > Wafer Fabrication - Overview > Regions of a wafer
surface > Scribe ... Molecular Expressions Chip Shots - Example of scribe lines ......
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日期:2024-08-13
scribe line--------its the boundary line of the die.....each scrieb line has guard rings
connections.....correct me also i wanna know how to ......
瀏覽:1200
日期:2024-08-09
4 Jun 2009 ... The wafer comprises a plurality of chip die areas arranged on the wafer in an
array and scribe line areas between the chip die areas....