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日期：2024-08-14
A system in package (SiP) or system-in-a-package, also known as a Chip Stack
MCM. An SiP is a number of integrated circuits enclosed in a single module ......
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日期：2024-08-15
System in Package (系統級封裝、系統構裝、SiP) 是基于SoC所發展出來的種封装
技術，根據Amkor對SiP定義為「在一IC包裝體中，包含多個晶片或一晶片，加上被動
......
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日期：2024-08-17
SiP（System in Package） SiP（系統級封裝）為一種封裝的概念，是將一個系統或子
系統的全部或大部份電子功能配置在整合型基板內，而晶片以2D、3D的方式接合到
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日期：2024-08-12
System in Package. Semiconductor industry demands for higher levels of
integration, lower costs, and a growing awareness of complete system
configuration ......
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日期：2024-08-13
2005年3月26日 ... 電子產業內普遍持有的一種誤解，認為系統級封裝(System-In-Package，SIP)僅僅是
一種製造/封裝技術，這種觀點低估了成功生產SIP產品的挑戰及 ......
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