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- www.ledinside.com.tw
  
  EFO 打火桿 ASM KNS wire bond | 集邦全球LED交易平台 - LED產業網
  
  供求首頁 > 產品 > 代理商與其他 > 零組件代理商 > EFO 打火桿 ASM KNS wire bond 產品價格(美元/US$) 所在地 $1.00 台灣發佈日期：2010-12-26 有效期限：不限 EFO 打火桿 ASM KNS wire bond 製造商漢洛科技股份有限公司台灣提供純白金打火棒(EFO ...
  
  2024-07-16
  
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- www.fantron.com
  
  Wire Bonding Tools W/B配件 EFO 打火桿
  
  EFO (Electronic Flame Off) Electrodes 打火桿 LD-Micro designs and manufactures wide range of EFO's ( torch / wand ) for most types of wire bonders in the industry. Using "proprietary material" to ensure consistent air balls and long lifespan.
  
  2024-07-11
  
  瀏覽：1413

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Experimental Study of EFO Ward Electrode Wear, Surface Pollution, and Discharge Gaps in Wire Bonding

日期：2024-07-13

44 Kuan-Jung Chung et al. The wire end is often bent towards one side after the wedge bond. To form the next ball, the EFO discharge must be able to fire from the tip of electrode to the bent wire....

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WIRE BOND - 豆丁網

日期：2024-07-15

WIRE BOND工藝詳細介紹 ... http://www.SemiNIC.com/ 中心半導體工藝論壇 1 Wir e Bond Pr ocess Wir e Bond Pr ocess Intr oduction Intr oduction 1....

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Wire Bond 中的EFO是什麼意思？或者誰知道這個EFO單詞的英文全稱是什麼？_科技_天涯問答

日期：2024-07-10

electronic flame-off 或者是eletronic fire-off ......

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Wire Bond--EFO open detected - Package Equipment[封裝設備] - 半導體技術天地 - 工程師的家園,專註于電子電路,半導體晶片 ...

日期：2024-07-15

Wire Bond--EFO open detected ,半導體技術天地 ... 返回列表查看: 2698 | 回覆: 9 Wire Bond--EFO open detected [複製鏈接] fzdlx2007 fzdlx2007 當前離線積分 36 發表于 2007-4-17 14:52:10 | 顯示全部樓層 | 閱讀模式|...

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CAPILLARY WIRE BONDING - BITA BeNeLux Home

日期：2024-07-16

of electronic flame-off (EFO), helped advance wire bonding capability from a pioneer technology to the proven and automated processes that exist today. Compression Bonding: Generally consists of gold-to ......

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Gold Wire and Bond Failure_百度文库 - 百度文库——让每个人平等地提升自我

日期：2024-07-10

本文件中的資料得隨時變更，而不事先通知。 6 二．Wire bond 的構成 FAB 的形成: Ball Bonding (1st 結合): 加熱 ... 全部用金線切斷放置一邊 1. 檢查線夾，銲針是否污染 2. 用 pant light 檢查是否有手指印 3. EFO 放電呈黃色，檢查指紋，E-Torch 1st 接合不良頸部 ......

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WellBond EFOs (All types)

日期：2024-07-13

Conclusion The results showed that EFO Tip from Well Bond is the best in term of Cost, Quality and Delivery. The EFO Tip Evaluation is very useful not only as a cost saving activity, but also helps to improve the Wire Bond Process quality in any machine ....

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Bonding to the chip face - Online Postgraduate Courses for the Electronics Industry

日期：2024-07-17

The repetitive bonding cycle has four parts: First bond. The capillary is moved directly above the target pad, and then lowered. This pulls the ball into the chamfer at the end of the capillary, centring it and tensioning the wire. When the ball is sensed...

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