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瀏覽:558
日期:2024-07-14
hardening in thermosonic wire bonding ... Cu FABs produced using EFO current (
IEFO) and EFO time (tEFO) of 250 mA and 0.118 ms, respectively, have 14.29 ......
瀏覽:938
日期:2024-07-11
energy, bonding force, bonding temperature, and time on wire bond quality, is ....
PdCu wire have shown that at a higher EFO current, an FAB with bare Cu wire ......
瀏覽:1020
日期:2024-07-17
The most common interconnect technology is wire bonding, specifically ball ... by
ionization of the air gap in a process called “electronic flame-off” (EFO)....
瀏覽:509
日期:2024-07-15
Longer Life up to 3x standard EFO wands. ○ New proprietary process for
superior sparking performance. Advancements in wire bonding technology and
today's ......
瀏覽:1487
日期:2024-07-12
Shortly thereafter, the ceramic capillary and the advent of electronic flame-off (
EFO), helped advance wire bonding capability from a pioneer technology to the....
瀏覽:505
日期:2024-07-10
Wire-Bonding - Thermosonic Bonding. Electronic Flame Offs (EFO's) ... Process
for all types of EFO used on various Wire Bonder machines such as ASM, K&S, ......
瀏覽:443
日期:2024-07-13
copper wire ball bonding technology was developed to be an alternative method
for the ... The wire ball bonder uses an EFO unit connecting with high voltage to ......
瀏覽:612
日期:2024-07-15
The stable bonding of gold wire is becoming more and more important with the
development of high integration and miniaturization of semiconductor....