Toshiba 300mm Wafer Fab - Semiconductor Technology

Toshiba 300mm Wafer Fab - Semiconductor Technology

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日期:2024-07-29
Toshiba Corp. and SanDisk are building a new 300mm wafer fabrication facility at Toshiba's Yokkaichi operations in Japan. The companies plan to start construction of the new facility, called Fab-4, in August 2006. Initial production......看更多