cof chip on film的相關文章
cof chip on film的相關公司資訊
cof chip on film的相關商品
南茂科技 >> 產品與服務 >> IC封裝服務 >> 量產產品系列
瀏覽:845
日期:2024-07-09
The FBGA package was designed as a cost-effective CSP solution specifically for high frequency memory devices (ex:DDR II). The structure provides the shortest wire length and outstanding electrical performance for the central-pad device layout through the...看更多