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A Finite Element Analysis of Board Level Drop Reliability Test and Analysis of Stress Buffer Effect
瀏覽:1472
日期:2024-07-17
Page.20 Solder UBM Si die PI RDL Adhesion between PI and RDL(Cu) Adhesion between PI and UBM Requirement for PI layer Stress release of intermediate compound Wide thickness margin High Modulus Good adhesion between PI and RDL (Cu) Good ......看更多