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![NovaPlus- Die Bonder and Flip Chip Bonder - AMICRA microtechnologies](https://www.iarticlesnet.com/pub/img/site/s_39.jpeg)
NovaPlus- Die Bonder and Flip Chip Bonder - AMICRA microtechnologies
瀏覽:811
日期:2024-07-11
The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets: Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die) MEMS Automotive Sensors RFID LED Optoelectronic For questions regarding the Nova Plus Die ......看更多