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Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders
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日期：2024-10-12
1 Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders Elviz George1, Michael Osterman1, Michael Pecht1, Richard Coyle2, Richard Parker3, and Elizabeth Benedetto4 1Center for Advanced Life Cycle Engineering (CALCE) University of Marylan...看更多
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